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Avant Electronics

XSemitron Technology Inc.

XS61M2G8C2TM-B8BEA

NAND multi-chip memory package

2G NAND (8bit ECC, x8) + 1G LPDDR2 (x32)

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Component information

ManufacturerXSemitron Technology Inc.
Part numberXS61M2G8C2TM-B8BEA
PackageBGA162 8x10.5x1.0mm
Memory configuration2G NAND (8bit ECC, x8) + 1G LPDDR2 (x32)
Supply voltage1.7 to 1.9 V
Operating temperature-25 to +85 °C
Packing methodTray
PackageBGA162 8x10.5x1.0mm

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