XSemitron Technology Inc.
XS61M1G8C2TM-B8BEA
NAND multi-chip memory package
1G NAND (8bit. ECC;x8) +1G LP DDR2 (x32)
Component information
| Manufacturer | XSemitron Technology Inc. |
|---|---|
| Part number | XS61M1G8C2TM-B8BEA |
| Package | BGA162 8x10.5x1.0mm |
| Memory configuration | 1G NAND (8bit. ECC;x8) +1G LP DDR2 (x32) |
| Supply voltage | 1.7 to 1.9 V |
| Operating temperature | -25 to +85 °C |
| Packing method | Tray |
| Package | BGA162 8x10.5x1.0mm |
Documentation
Confirm specifications, suitability and required inspection before ordering.